Spinel
Technology Assessment & Transfer Inc. (TA&T) leads the development and commercialization efforts for transparent polycrystalline Spinel and other optical ceramics in the United States. Benefiting from past and present support from the Department of Defense, the Department of Energy and the Missile Defense Agency, transparent Spinel markets and products have advanced to become viable technical solutions with unique properties, forming capabilities and cost advantages not available in other transparent ceramic materials.
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The cubic structure of Spinel makes it ideal for transparent applications requiring high strength and resistance
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Transparent magnesium aluminate (MgAl2O4) ceramics, also known as transparent Spinel, have been in existence for many decades. Spinel’s suitability in transparent armor and electro-optic applications stems from its inherent hardness, stopping power and extended transmission range in mid-wave IR. Historically, the reproducible performance of Spinel has been low. However, due to continually increasing performance requirements of current and next-generation electro-optic platforms and armor systems, demand for transparent Spinel is greater now than ever before. This demand fueled innovations within TA&T affecting all areas of development: Spinel powder handling, processing and finishing technologies. Now, Spinel’s reproducible processability affords economy of scale that make it attractive for meeting the ever demanding cost targets of advanced weapons systems and commercial products.
In addition to advancing development efforts of transparent Spinel, TA&T specializes in other optical ceramics for laser gain media and scintillators. Optical ceramics such as Nd:YAG and Ti:MgAl2O4 have recently become viable materials for ceramic polycrystalline laser gain media, and advances in polycrystalline ceramics for laser applications has significant crossover with polycrystalline materials for scintillators.
Ta&T news
Annapolis, MD – November 29, 2011 – Ceramic Stereolithography (CSL), a unique manufacturing process developed by Technology Assessment and Transfer, Inc. (TA&T) under multiple SBIR and internally funded programs, was used to make ceramic heater bodies that are onboard the recently launched Mars rover named Curiosity.
Contracted by the NASA Goddard Space Flight Center, TA&T fabricated alumina pyrolysis oven housings that are being used in the Sample Analysis at Mars (SAM) suite of instruments. Patrick Jordan, a NASA engineer, explained that due to the complex nature of the housing, traditional machining of the ceramic was too expensive to undertake. The major impediment to machining the housing is a series of 52 closely spaced, small diameter (.012”) holes through which heating elements are placed. Impressively, the CSL process was able to create fully functional prototypes that survived the rapid heating to >1,000°C. The parts passed thermal shock and thermal cycle durability testing, and will be used on Mars to heat soil samples to determine the presence of water and organic compounds that indicate the possibility of life on Mars.
The CSL process has applications beyond space exploration, including those which have consumer and industrial applications. The process requires no tooling and therefore allows rapid prototyping of fully-functional ceramic parts. TA&T has been involved in the development of rocket engine fuel injectors, heat exchangers for cooling electronics in hybrid electric vehicles, ceramic molds for turbine engine blades, and electrosurgical medical device tips, among other development projects.
Photographs of the TA&T produced ceramic heater housing for the Mars Science Laboratory can be found in the Ceramic Stereolithography gallery.
Additional information about the Mars Science Laboratory mission can be found at http://www.nasa.gov/mission_pages/msl/index.html.
Annapolis, MD – November 21, 2011 – Technology Assessment & Transfer, Inc. has just completed a kickoff meeting as a prime contractor on an Air Force SBIR Phase II.
Led by Dr. James Hom, the Air Force Phase II effort is focused on advanced cooling and packaging designs for electronic components within an aircraft's power electronic converter. The proposed component level solutions substantially reduce the thermal resistances between the highest heat producing components (e.g., the power switching modules, magnetic inductors, and capacitors) and the coolant. These solutions will be integrated into an existing power electronic converter and tested in a simulated aircraft environment. An increase in maximum allowable inlet coolant temperature of at least 30°C is expected.
