Thermal Management - Microchannel Cooling
The high heat transfer ability of microchannels was first demonstrated by Tuckerman and Pease. Cold plates containing microchannels or microstructures offer high heat transfer rates. These microchannel cold plates are generally attached to the electronics package with a thermal conductive epoxy, pad or grease. A more effective approach is to integrate the microchannel structure into a layer that is closer to the heat producing device. This removes layers of material in the thermal resistance path which can significantly improve the cooling of the heat source.
TA&T has developed a ceramic processing technique using ceramic stereolithography (CSL) that allows the fabrication of monolithic ceramic microchannel cold plates with features and dimensions down to 150 μm. The fabrication process involves the definition of the ceramic green part using a proprietary photosensitive ceramic resin. The part is built by selectively laser curing the resin layer by layer. The layer thickness of ceramic parts can be as small as 25 μm. The ceramic green part then goes through a firing process to burn out the resin and to increase the density of the ceramic part.
TA&T has consistantly demonstrated the benefits of integrating the ceramic microchannel heat sinks/cold plates into electronic packages during the course of multiple SBIR projects.


