Thermal Management - Microchannel Cooling

The high heat transfer ability of microchannels was first demonstrated by Tuckerman and Pease.  Cold plates containing microchannels or microstructures offer high heat transfer rates.  These microchannel cold plates are generally attached to the electronics package with a thermal conductive epoxy, pad or grease.  A more effective approach is to integrate the microchannel structure into a layer that is closer to the heat producing device.  This removes layers of material in the thermal resistance path which can significantly improve the cooling of the heat source.

 

TA&T has developed a ceramic processing technique using ceramic stereolithography (CSL) that allows the fabrication of monolithic ceramic microchannel cold plates with features and dimensions down to 150 μm.  The fabrication process involves the definition of the ceramic green part using a proprietary photosensitive ceramic resin.  The part is built by selectively laser curing the resin layer by layer.  The layer thickness of ceramic parts can be as small as 25 μm.  The ceramic green part then goes through a firing process to burn out the resin and to increase the density of the ceramic part.

 

TA&T has consistantly demonstrated the benefits of integrating the ceramic microchannel heat sinks/cold plates into electronic packages during the course of multiple SBIR projects.

Ta&T news

TA&T Ceramic Stereolithographically Produced Parts Integral to Instrument Package on NASA Mars Science Laboratory’s Curiosity Rover

Annapolis, MD – November 29, 2011 – Ceramic Stereolithography (CSL), a unique manufacturing process developed by Technology Assessment and Transfer, Inc. (TA&T) under multiple SBIR and internally funded programs, was used to make ceramic heater bodies that are onboard the recently launched Mars rover named Curiosity.


Contracted by the NASA Goddard Space Flight Center, TA&T fabricated alumina pyrolysis oven housings that are being used in the Sample Analysis at Mars (SAM) suite of instruments. Patrick Jordan, a NASA engineer, explained that due to the complex nature of the housing, traditional machining of the ceramic was too expensive to undertake. The major impediment to machining the housing is a series of 52 closely spaced, small diameter (.012”) holes through which heating elements are placed. Impressively, the CSL process was able to create fully functional prototypes that survived the rapid heating to >1,000°C. The parts passed thermal shock and thermal cycle durability testing, and will be used on Mars to heat soil samples to determine the presence of water and organic compounds that indicate the possibility of life on Mars.


The CSL process has applications beyond space exploration, including those which have consumer and industrial applications. The process requires no tooling and therefore allows rapid prototyping of fully-functional ceramic parts. TA&T has been involved in the development of rocket engine fuel injectors, heat exchangers for cooling electronics in hybrid electric vehicles, ceramic molds for turbine engine blades, and electrosurgical medical device tips, among other development projects.


Photographs of the TA&T produced ceramic heater housing for the Mars Science Laboratory can be found in the Ceramic Stereolithography gallery.

 

Additional information about the Mars Science Laboratory mission can be found at http://www.nasa.gov/mission_pages/msl/index.html.

 

TA&T Completes Air Force SBIR Phase II Kickoff Meetings

Annapolis, MD – November 21, 2011 – Technology Assessment & Transfer, Inc. has just completed a kickoff meeting as a prime contractor on an Air Force SBIR Phase II.

 

Led by Dr. James Hom, the Air Force Phase II effort is focused on advanced cooling and packaging designs for electronic components within an aircraft's power electronic converter. The proposed component level solutions substantially reduce the thermal resistances between the highest heat producing components (e.g., the power switching modules, magnetic inductors, and capacitors) and the coolant. These solutions will be integrated into an existing power electronic converter and tested in a simulated aircraft environment. An increase in maximum allowable inlet coolant temperature of at least 30°C is expected.

 

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